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Title:
BONE-CONDUCTION MICROPHONE, HEADSET DEVICE AND MICROPHONE DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/131360
Kind Code:
A1
Abstract:
A microphone (40) of a headset device is provided with a sensor support member (46) for supporting a convex portion (46B) in a state separated from a microphone housing (41) to transmit a vibration to a vibration sensor (47), wherein a plurality of circular members (46D1) with different diameters are formed at a support unit (46D) of the sensor support member (46).  The sensor support member (46) is made of an elastic material.  Thus, the convex portion (46B) (the vibration sensor) is in a floating state against the microphone housing (41).  Even in the case where a sliding vibration between an ear hook and an ear and the like are generated on the ear hook side, the support unit (46D) (each circular groove (46D1)) of the sensor support member (46) absorbs the vibration, so that the transmission of a vibration from the outside to the vibration sensor (47) is restricted.

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Inventors:
NOMURA YASUHIKO (JP)
Application Number:
PCT/JP2009/059071
Publication Date:
November 18, 2010
Filing Date:
May 15, 2009
Export Citation:
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Assignee:
NIPPON MMI TECHNOLOGY INC (JP)
NOMURA YASUHIKO (JP)
International Classes:
H04R1/00
Foreign References:
JPS6059690U1985-04-25
JPS6090995U1985-06-21
JPH0256121A1990-02-26
JPH07222293A1995-08-18
Attorney, Agent or Firm:
ASAHI PATENT FIRM (JP)
Patent business corporation morning-sun patent firm (JP)
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