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Patent Searching and Data


Title:
BUILDING PANEL
Document Type and Number:
WIPO Patent Application WO/2024/113168
Kind Code:
A1
Abstract:
A multi-layer building panel article including: (A) at least one layer of a polyvinylchloride material; (B) at least one tie layer of a composition including: (Bi) at least one ethylene-acrylate copolymer resin; (Bii) at least one tackifier; and (Biii) at least one inorganic filler material; and (C) at least one layer of a metal substrate; and a process for manufacturing the above multi-layer building panel article.

Inventors:
WANG JINFEI (CN)
MIAO WENKE (CN)
CHEN TINGTING (CN)
REN SHIJIE (CN)
GENG XIANG (CN)
SONG XIAOMEI (CN)
SUN YABIN (CN)
LIAO GUIHONG (CN)
Application Number:
PCT/CN2022/135086
Publication Date:
June 06, 2024
Filing Date:
November 29, 2022
Export Citation:
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Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
WANG JINFEI (CN)
MIAO WENKE (CN)
CHEN TINGTING (CN)
REN SHIJIE (CN)
GENG XIANG (CN)
SONG XIAOMEI (CN)
SUN YABIN (CN)
LIAO GUIHONG (CN)
International Classes:
C08L23/08; B32B27/00; B32B27/32; C08L33/08; C09D123/08; C09J123/08
Foreign References:
CN1930231A2007-03-14
CN101018820A2007-08-15
CN101052676A2007-10-10
CN102559078A2012-07-11
CN107921767A2018-04-17
US20080254308A12008-10-16
Attorney, Agent or Firm:
WU, FENG & ZHANG (CN)
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