Title:
BUS BAR ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2019/049687
Kind Code:
A1
Abstract:
A bus bar assembly according to the present invention has: a first bus bar of a conductive metal plate; a second bus bar of a conductive metal plate disposed on the same plane as the first bus bar in a state in which a gap is present between the second bus bar and the opposing side surface of the first bus bar; and an insulation resin layer filled in the gap and connecting the opposing side surfaces of the first and second bus bars. Preferably, at least one of the opposing side surfaces of the first and second bus bars is an inclined surface that approaches the other side surfaces of the first and second bus bars progressively from one side to the other side in the thickness direction.
Inventors:
NAKAGAWA MASAYA (JP)
Application Number:
PCT/JP2018/031315
Publication Date:
March 14, 2019
Filing Date:
August 24, 2018
Export Citation:
Assignee:
SUNCALL CORP (JP)
International Classes:
H01B7/00; B05D5/12; B05D7/14; H01B13/00
Domestic Patent References:
| WO2012053580A1 | 2012-04-26 |
Foreign References:
| JP2007215340A | 2007-08-23 | |||
| EP1087300A2 | 2001-03-28 | |||
| JP4432913B2 | 2010-03-17 | |||
| JP2016216766A | 2016-12-22 |
Other References:
See also references of EP 3675141A4
Attorney, Agent or Firm:
ARAWORE INTERNATIONAL IP LAW FIRM (JP)
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