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Title:
SEMI−RIGID CABLE
Document Type and Number:
WIPO Patent Application WO/2003/028040
Kind Code:
A1
Abstract:
A semi−rigid cable coaxially includes a brass wire (1) having a silver−plated layer (2) formed by plating silver having a high conductivity, a dielectric body (3) prepared by using fluorocarbon resin, a polymer film (4) having a conductive film (inner layer of an outer conductor) (5) formed by deposition, and a metal pipe (6) having a low thermal conductivity as an outer layer of the outer conductor. The polymer film (4) is inserted into the metal pipe (6) with the conductive film (5) toward the outer circumference so that the conductive film (5) is electric contact with the metal pipe (6). The conductive film (5) has a thickness in a range not smaller than 1 micron and not greater than 10 microns.

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Inventors:
HATTORI WATARU (JP)
Application Number:
PCT/JP2002/008401
Publication Date:
April 03, 2003
Filing Date:
August 21, 2002
Export Citation:
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Assignee:
NEC CORP (JP)
HATTORI WATARU (JP)
International Classes:
H01B12/02; H01B13/22; H01B11/18; H01P3/06; (IPC1-7): H01B11/18; H01B11/06
Foreign References:
JPH0412215U1992-01-31
JPS54133383U1979-09-14
JPS62295309A1987-12-22
JPH04127918U1992-11-20
JPH11224547A1999-08-17
Other References:
See also references of EP 1426980A4
Attorney, Agent or Firm:
Hirata, Tadao (Park Side House 2, Ichibanch, Chiyoda-ku Tokyo, JP)
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