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Title:
CARBON FIBER BUNDLE, PROCESS FOR PRODUCING THE SAME, AND THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2005/012604
Kind Code:
A2
Abstract:
A carbon fiber bundle which can have satisfactory interfacial adhesion to polyolefin resins, especially polypropylene resins. The carbon fiber bundle comprises two or more fibers and has been sized with a sizing agent comprising either a polymer which has a main chain made up of carbon-carbon bonds, has an acid group in at least part of the side chains or at at least part of the ends of the main chain, and has an acid value as measured in accordance with ASTM D 1386 of 23 to 120 mg-KOH/g or a polymer which has a main chain made up of carbon-carbon bonds and has at least either of epoxy and ester groups in at least part of the side chains or at at least part of the ends of the main chain.

Inventors:
SUGIURA NAOKI (JP)
FUKUSHIMA AKIHIKO (JP)
FUJIE SHINOBU (JP)
Application Number:
PCT/JP2004/011053
Publication Date:
February 10, 2005
Filing Date:
August 02, 2004
Export Citation:
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Assignee:
MITSUBISHI RAYON CO (JP)
SUGIURA NAOKI (JP)
FUKUSHIMA AKIHIKO (JP)
FUJIE SHINOBU (JP)
International Classes:
C08J5/06; D06M13/513; D06M15/227; D06M15/263; D06M15/55; D01F; (IPC1-7): D01F/
Foreign References:
JPH06173170A1994-06-21
JPH05195440A1993-08-03
JPS60139875A1985-07-24
JPS6053544A1985-03-27
JPS4986697A1974-08-20
Attorney, Agent or Firm:
Miyazaki, Teruo (16th Kowa Bldg. 9-20, Akasaka 1-chom, Minato-ku Tokyo 52, JP)
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