Title:
CERAMIC SUBSTRATE FOR POWER MODULE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/101737
Kind Code:
A1
Abstract:
The present invention relates to a ceramic substrate for a power module and a manufacturing method thereof. A ceramic substrate for a power module according to one embodiment of the present invention may comprise: a ceramic substrate; an upper electrode bonded to the upper surface of the ceramic substrate and having a groove configured to mount a semiconductor element; and a lower electrode bonded to the lower surface of the ceramic substrate and having a plurality of protrusion parts provided on the lower surface so as to correspond to the groove.
Inventors:
LEE JIHYUNG (KR)
Application Number:
PCT/KR2023/016847
Publication Date:
May 16, 2024
Filing Date:
October 27, 2023
Export Citation:
Assignee:
AMOGREENTECH CO LTD (KR)
International Classes:
H05K1/02; H01L23/15; H01L23/367; H05K1/03; H05K7/20
Foreign References:
| KR100852766B1 | 2008-08-18 | |||
| JP2016051878A | 2016-04-11 | |||
| KR20190139810A | 2019-12-18 | |||
| JP2015126168A | 2015-07-06 | |||
| KR20210070928A | 2021-06-15 |
Attorney, Agent or Firm:
KIM, Churchill (KR)
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