Title:
CHIP ATTACHMENT IN AN RFID TAG
Document Type and Number:
WIPO Patent Application WO2004088570
Kind Code:
A3
Abstract:
A system and method for attaching an RFID chip to a conductive pattern is disclosed. According to the invention, multiple die are aligned with respective multiple conductive modules for structural and electrical attachment. As disclosed, the multiple die can be attached near simultaneously and without the need for intermediate handling. Therefore, substantial cost benefits are realized. Also disclosed is a method of making electrical connections employing the use of a laser. A photosensitive adhesive material is used to structurally secure the attachment.
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Inventors:
ROESNER BRUCE B (US)
Application Number:
PCT/US2004/009050
Publication Date:
June 09, 2005
Filing Date:
March 24, 2004
Export Citation:
Assignee:
BELLA ID SOLUTIONS INC (US)
ROESNER BRUCE B (US)
ROESNER BRUCE B (US)
International Classes:
G06K19/077; H01L21/00; H01L21/56; H01L21/60; H05K13/04; (IPC1-7): H01L21/44; H01L21/46; H01L21/48; H01L21/50; H01L21/78; H01L21/301
Foreign References:
| US3722072A | 1973-03-27 | |||
| US3724068A | 1973-04-03 | |||
| US3868764A | 1975-03-04 | |||
| US5897337A | 1999-04-27 |
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