Title:
CHIP CARD
Document Type and Number:
WIPO Patent Application WO1998006060
Kind Code:
A3
Abstract:
The invention concerns a chip card with a semiconductor chip (2) - lead frame (3) combination. To design a reliable chip card that can withstand bending and tensile loads, the connecting lugs of the lead frame (3) which constitute the galvanic contacts (9) extend outwards and are embedded in the plastic body of the card (1). Beads (10) are fitted to provide greater relief from mechanical stresses.
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Inventors:
DLUGOSCH DIETER (DE)
PRASS ROLAND (DE)
KIRSCHBAUER JOSEF (DE)
DIDSCHIES GUENTER (DE)
PRASS ROLAND (DE)
KIRSCHBAUER JOSEF (DE)
DIDSCHIES GUENTER (DE)
Application Number:
PCT/DE1997/001626
Publication Date:
October 10, 2002
Filing Date:
July 31, 1997
Export Citation:
Assignee:
SIEMENS AG (DE)
DLUGOSCH DIETER (DE)
PRASS ROLAND (DE)
KIRSCHBAUER JOSEF (DE)
DIDSCHIES GUENTER (DE)
DLUGOSCH DIETER (DE)
PRASS ROLAND (DE)
KIRSCHBAUER JOSEF (DE)
DIDSCHIES GUENTER (DE)
International Classes:
B42D25/455; B42D25/305; G06K19/077; (IPC1-7): G06K19/077
Foreign References:
| DE4441931C1 | 1995-07-27 | |||
| EP0343030A1 | 1989-11-23 | |||
| EP0688051A1 | 1995-12-20 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 015, no. 010 (M - 1068) 10 January 1991 (1991-01-10)
PATENT ABSTRACTS OF JAPAN vol. 015, no. 443 (M - 1178) 12 November 1991 (1991-11-12)
PATENT ABSTRACTS OF JAPAN vol. 015, no. 443 (M - 1178) 12 November 1991 (1991-11-12)
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