Title:
CHIP ENCAPSULATION STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/179543
Kind Code:
A1
Abstract:
Disclosed are a chip encapsulation structure and an electronic device, belonging to the technical field of chip encapsulation. The chip encapsulation structure comprises a bare chip, a bare chip carrier and an encapsulation body; the bare chip is located on one side of the bare chip carrier; the encapsulation body covers the outside of the bare chip; and the bare chip is encapsulated on the bare chip carrier. An outer surface of the encapsulation body is provided with a recess structure. The recess structure serves to increase a heat dissipation area of the encapsulation body. The recess structure increases a surface area of the encapsulation body, so as to increase the heat dissipation area of the encapsulation body and enhance the heat dissipation capacity of the encapsulation body; in addition, an area outside the recess structure still ensures that the encapsulation body has sufficient structural strength, such that the chip encapsulation structure is not prone to being damaged when subjected to a physical impact.
Inventors:
WAN JUN (CN)
Application Number:
PCT/CN2022/077579
Publication Date:
September 01, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/31; H01L23/34
Foreign References:
| CN1761051A | 2006-04-19 | |||
| CN101035411A | 2007-09-12 | |||
| CN206819986U | 2017-12-29 | |||
| CN110828539A | 2020-02-21 | |||
| CN109887890A | 2019-06-14 |
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