Title:
CHIP HEAT DISSIPATION ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/093214
Kind Code:
A1
Abstract:
The present application belongs to the field of communication equipment and discloses a chip heat dissipation assembly and an electronic device. The chip heat dissipation assembly comprises: a circuit board, a chip assembly, a supporting structure piece, and a heat sink, wherein: the chip assembly is arranged on the circuit board; the supporting structure piece is arranged at a preset position of the circuit board, the distance between the preset position and a target position is smaller than a first threshold, and the target position is the position on the circuit board corresponding to the location of the center of gravity of the heat sink; the heat sink is installed above the chip assembly; and when the heat sink is in an installed state, the face of the chip assembly away from the circuit board and the face of the supporting structure piece away from the circuit board are in contact with the heat sink.
More Like This:
Inventors:
YAN CHAO (CN)
Application Number:
PCT/CN2023/096862
Publication Date:
May 10, 2024
Filing Date:
May 29, 2023
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K7/20
Foreign References:
| CN106612598A | 2017-05-03 | |||
| CN203192783U | 2013-09-11 | |||
| CN109508078A | 2019-03-22 | |||
| CN204906853U | 2015-12-23 | |||
| EP1791177A1 | 2007-05-30 |
Attorney, Agent or Firm:
COHORIZON INTELLECTUAL PROPERTY INC. (CN)
Download PDF: