Title:
CHIP TESTING METHOD AND APPARATUS, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/156203
Kind Code:
A1
Abstract:
A chip testing method and apparatus, and an electronic device. The method comprises: determining the positions of solder pads in a set state in a target chip and the positions of solder pads in a non-set state according to the solder pad distribution information of the target chip, each solder pad in a set state being a solder pad having a set state, the set state comprising a first state or a second state (S1); determining a plurality of solder pad state setting schemes according to the positions of the solder pads in a set state and the positions of the solder pads in a non-set state, each solder pad state setting scheme comprising setting each solder pad in a non-set state to be in the first state or the second state (S2); and determining, according to the information of the differential pressure solder pad pairs in each solder pad state setting scheme, a test voltage setting scheme that satisfies a preset condition, each differential pressure solder pad pair consisting of two adjacent solder pads in different states (S3).
Inventors:
GAO HANG (CN)
Application Number:
PCT/CN2021/113353
Publication Date:
July 28, 2022
Filing Date:
August 18, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G01R31/28
Foreign References:
| CN112904179A | 2021-06-04 | |||
| CN101593563A | 2009-12-02 | |||
| CN110470975A | 2019-11-19 | |||
| CN103630824A | 2014-03-12 | |||
| CN102945684A | 2013-02-27 | |||
| CN106876366A | 2017-06-20 | |||
| US20010047496A1 | 2001-11-29 |
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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