Title:
CIRCUIT BOARD FOR LARGE-CAPACITY MODULE PERIPHERAL CIRCUIT AND LARGE-CAPACITY MODULE CONTAINING PERIPHERAL CIRCUIT USING SAID CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2013/054408
Kind Code:
A1
Abstract:
[Problem] In a large-capacity module designed to be more compact/lightweight, reduce surge and reduce loss by integrating a drive circuit or other peripheral circuit into a power circuit, to reduce problems such as an increase in electrical resistance in a junction portion between a terminal of a power semiconductor element and an electrode of the peripheral circuit, and a decrease in dielectric strength between adjacent junction portions, said problems being caused by inadequate positioning of the terminal of the power semiconductor element arranged on the power circuit, relative to the electrode of the peripheral circuit. [Solution] Problems such as the abovementioned are reduced by providing a step on the surface of the peripheral circuit board, and, during integration of the power circuit with the peripheral circuit by means of contact between said step and a side surface of the power semiconductor element, positioning the electrode of the peripheral circuit board more accurately relative to the terminal of the power semiconductor element.
Inventors:
YANO SHINSUKE (JP)
HIRAI TAKAMI (JP)
NANATAKI TSUTOMU (JP)
YAMAGUCHI HIROFUMI (JP)
HIRAI TAKAMI (JP)
NANATAKI TSUTOMU (JP)
YAMAGUCHI HIROFUMI (JP)
Application Number:
PCT/JP2011/073446
Publication Date:
April 18, 2013
Filing Date:
October 12, 2011
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
YANO SHINSUKE (JP)
HIRAI TAKAMI (JP)
NANATAKI TSUTOMU (JP)
YAMAGUCHI HIROFUMI (JP)
YANO SHINSUKE (JP)
HIRAI TAKAMI (JP)
NANATAKI TSUTOMU (JP)
YAMAGUCHI HIROFUMI (JP)
International Classes:
H01L23/48; H01L21/60; H01L25/07; H01L25/18
Foreign References:
| JP2006303006A | 2006-11-02 | |||
| JP2005150596A | 2005-06-09 | |||
| JPH08162579A | 1996-06-21 | |||
| JPS5710748U | 1982-01-20 | |||
| JP2006303006A | 2006-11-02 | |||
| JP3410696B2 | 2003-05-26 | |||
| JP2011023654A | 2011-02-03 | |||
| JP2007012831A | 2007-01-18 |
Other References:
FENGQUN LANG; YUSUKE HAYASHI; HIROSHI NAKAGAWA; MASAHIRO AOYAGI; HIROMICHI OHASHI: "A Three-Dimensional Packaging Method for AI-Metalized SiC Power Devices", 18TH MICROELECTRONICS SYMPOSIUM, September 2008 (2008-09-01), pages 219 - 222
Attorney, Agent or Firm:
PROSPEC PATENT FIRM (JP)
Patent business corporation Pros Peck patent firm (JP)
Patent business corporation Pros Peck patent firm (JP)
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Claims:
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