Title:
CIRCUIT BOARD PACKAGING STRUCTURE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/083095
Kind Code:
A1
Abstract:
A circuit board packaging structure (210), a circuit board assembly (200), and an electronic device (01), which relate to the technical field of circuit boards, and are used for solving or at least partially solving the technical problem of large crosstalk noise during high-speed signal transmission. The circuit board packaging structure (210) comprises a circuit board (211), at least one signal via hole group (212), and a shielding structure (213). The circuit board (211) comprises a substrate body (2110), and a signal wire (2111) and a grounding layer (2112), which are arranged inside the substrate body (2110). The signal via hole group (212) comprises at least one signal via hole (2121), wherein the signal via hole (2121) penetrates at least part of the substrate body (2110), and the signal via hole (2121) is electrically connected to the signal wire (2111). The shielding structure (213) penetrates at least part of the substrate body (2110), and the shielding structure (213) is arranged around the periphery of the signal via hole group (212) and is electrically connected to the grounding layer (2112). The circuit board packaging structure (210) is used for connecting an electronic element (220).
Inventors:
TIAN YAOHUA (CN)
YE TAO (CN)
YE TAO (CN)
Application Number:
PCT/CN2022/129632
Publication Date:
May 19, 2023
Filing Date:
November 03, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/02
Domestic Patent References:
| WO2016115742A1 | 2016-07-28 |
Foreign References:
| CN107041062A | 2017-08-11 | |||
| CN113573463A | 2021-10-29 | |||
| JPH09307273A | 1997-11-28 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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