CIRCUIT BOARD, SEMICONDUCTOR DEVICE USING THAT CIRCUIT BOARD, AND ELECTRONIC DEVICE USING THAT CIRCUIT BOARD

Title:

CIRCUIT BOARD, SEMICONDUCTOR DEVICE USING THAT CIRCUIT BOARD, AND ELECTRONIC DEVICE USING THAT CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2003/060997

Kind Code:

A1

Abstract:

A circuit board that can maintain single integrity even during a high-speed operation, a semiconductor device using that circuit board, and an electronic device using that circuit board are provided at low costs without any obstacles to downsizing of the circuit board and the semiconductor device. On an interposer substrate (29), a wiring (28) is formed that connects an external connection terminal (13) to a connection part (8) connected to an output terminal (6) of a semiconductor chip (5), and a thin film resistor (27) is formed in the wiring (28) by use of a plating method.

Inventors:

KAYABA MASAO (JP)
ORUI KEN (JP)
MATSUDA YOSHINARI (JP)
SANWO IKUO JIMMY (US)

Application Number:

PCT/JP2003/000066

Publication Date:

July 24, 2003

Filing Date:

January 08, 2003

Export Citation:

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Assignee:

SONY CORP (JP)
KAYABA MASAO (JP)
ORUI KEN (JP)
MATSUDA YOSHINARI (JP)
SANWO IKUO JIMMY (US)

International Classes:

H01L23/12; H01L23/31; H01L23/552; H01L23/64; H05K1/02; H05K1/16; (IPC1-7): H01L23/12

Foreign References:

EP0562629A2	1993-09-29
JP2001148442A	2001-05-29
US5140407A	1992-08-18
JPH1174449A	1999-03-16
US5872393A	1999-02-16

Attorney, Agent or Firm:

Nakamura, Tomoyuki c/o Miyoshi International Patent Office (9th Floor Toranomon Daiichi Building, 2-3, Toranomon 1-chom, Minato-ku Tokyo, JP)

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