Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/125988
Kind Code:
A1
Abstract:
A circuit board of the present invention is provided with a main body section, a wiring pattern, and a through hole. The wiring pattern is provided on the front surface of the main body section. The through hole is formed in a main body section portion where the wiring pattern is provided. The through hole has a first end and a second end. The wiring pattern is provided with a first front surface-side wiring pattern, and an inner surface-side wiring pattern. The first front surface-side wiring pattern is formed on the first end-side front surface of the main body section. The inner surface-side wiring pattern is formed on the inner surface of the through hole by being connected to the first front surface-side wiring pattern. Furthermore, between the first end and the second end in the penetrating direction, the through hole has the minimum section where the area of a surface perpendicular to the penetrating direction is minimum. The inner surface-side wiring pattern is formed from the first end to a position beyond the minimum section.
Inventors:
MORITA YOSUKE
Application Number:
PCT/JP2016/005224
Publication Date:
July 27, 2017
Filing Date:
December 27, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K1/02
Foreign References:
| JPH1197809A | 1999-04-09 | |||
| JP2005327950A | 2005-11-24 | |||
| JP2009071299A | 2009-04-02 | |||
| JP2006202870A | 2006-08-03 | |||
| JP2002523891A | 2002-07-30 |
Other References:
See also references of EP 3407685A4
Attorney, Agent or Firm:
KAMATA, Kenji et al. (JP)
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