Title:
CIRCUIT CONNECTING ADHESIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND CIRCUIT MEMBER CONNECTING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/123003
Kind Code:
A1
Abstract:
A circuit connecting adhesive film is provided for connecting a first circuit
member, in which a first circuit electrode is formed on the main plane of a first
substrate, with a second circuit member, in which a second circuit electrode
is formed on the main plane of a second substrate, in a status where the first and
the second circuit electrodes are arranged to face each other. The film is provided
with at least a conductive adhesive layer (3) containing conductive particles
(1) and an adhesive (2); a first insulating adhesive layer (4) formed on one plane
of the conductive adhesive layer (3); and a second insulating adhesive layer
(5) formed on the conductive adhesive layer (3) on the plane opposite to the plane
whereupon the first insulating adhesive layer (4) is formed. The thickness of
at least one layer of the first and the second insulating adhesive layers (4, 5)
is 0.1-5.0μm.
Inventors:
HIROSAWA YUKIHISA (JP)
IIMURA TADAMITSU (JP)
IIMURA TADAMITSU (JP)
Application Number:
PCT/JP2007/057667
Publication Date:
November 01, 2007
Filing Date:
April 05, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
HIROSAWA YUKIHISA (JP)
IIMURA TADAMITSU (JP)
HIROSAWA YUKIHISA (JP)
IIMURA TADAMITSU (JP)
International Classes:
H01R11/01; C09J7/10; C09J201/00; H05K1/14; H05K3/32
Foreign References:
| JPH04366630A | 1992-12-18 | |||
| JPH07230840A | 1995-08-29 | |||
| JPH0316147A | 1991-01-24 | |||
| JPH01236588A | 1989-09-21 | |||
| JPH0218809A | 1990-01-23 | |||
| JPH08279371A | 1996-10-22 | |||
| JP2002076607A | 2002-03-15 |
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg.10-6, Ginza 1-chom, Chuo-ku Tokyo, JP)
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