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Title:
CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2005/002002
Kind Code:
A1
Abstract:
The invention provides a circuit connecting material for connecting to each other a circuit member (30) having an electrode (32) and an insulation layer (33) formed adjacent each other on the surface (31a) of a substrate (31), and a circuit member (40) having an electrode (42) and an insulation layer (43) formed adjacent each other on the surface (41a) of a substrate (41), the edges (33a, 43a) of the insulation layers (33, 43) being thicker than the electrodes (32, 42) with the main surfaces (31a, 41a) used as references, wherein the circuit connecting material contains an adhesive agent composition (51) and electrically conductive particles (12) whose mean particle size is from 1 μm to less than 10μm and whose hardness is 1.961 - 6.865 GPa, and when the circuit connecting material undergoes hardening process, its storage elasticity modulus at 40ºC is 0.5 - 3 GPa and its mean thermal expansion coefficient at 25ºC to 100ºC is 30 - 200 ppm/ºC.

Inventors:
ARIFUKU MOTOHIRO (JP)
WATANABE ITSUO (JP)
GOTOU YASUSHI (JP)
KOBAYASHI KOUJI (JP)
KOJIMA KAZUYOSHI (JP)
Application Number:
PCT/JP2004/008896
Publication Date:
January 06, 2005
Filing Date:
June 24, 2004
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
ARIFUKU MOTOHIRO (JP)
WATANABE ITSUO (JP)
GOTOU YASUSHI (JP)
KOBAYASHI KOUJI (JP)
KOJIMA KAZUYOSHI (JP)
International Classes:
C09J9/02; C09J163/00; H01B1/22; H01L21/60; H05K3/32; H05K3/34; (IPC1-7): H01R11/01; C09J9/02; C09J163/00; H01B1/00; H01B1/22; H01L21/60; H05K1/14; H05K3/36
Foreign References:
JP2001189171A2001-07-10
JPH08293526A1996-11-05
JPH0430542A1992-02-03
JPS59120436A1984-07-12
JPS60191228A1985-09-28
JPH01251787A1989-10-06
JPH0790237A1995-04-04
Other References:
See also references of EP 1628363A4
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Ginza First Bldg. 10-6, Ginza 1-chom, Chuo-ku Tokyo 61, JP)
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