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Title:
A CIRCUIT ENCAPSULATION TECHNIQUE UTILIZING ELECTROPLATING
Document Type and Number:
WIPO Patent Application WO2002100769
Kind Code:
A3
Abstract:
A novel technology is provided for encapsulating electronics (14) for use in harsh media applications, such as biomedical implants. The present invention includes electroplating a metal film (20) on top of an insulating layer (18) to hermetically seal an electronic system (14), microstructure, or micro device.

Inventors:
STARK BRIAN (US)
NAJAFI KHALIL (US)
Application Number:
PCT/US2002/017778
Publication Date:
October 30, 2003
Filing Date:
June 05, 2002
Export Citation:
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Assignee:
UNIV MICHIGAN (US)
STARK BRIAN (US)
NAJAFI KHALIL (US)
International Classes:
B81B7/00; H01L23/31; (IPC1-7): B81B7/00; H01L23/29; H01L23/10
Domestic Patent References:
WO1984001666A11984-04-26
Foreign References:
EP0435530A21991-07-03
US4620661A1986-11-04
Other References:
PATENT ABSTRACTS OF JAPAN vol. 005, no. 149 (E - 075) 19 September 1981 (1981-09-19)
KHALIL NAJAFI: "INTEGRATED SENSORS IN BIOLOGICAL ENVIRONMENTS", SENSORS AND ACTUATORS B, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. B01, no. 1/6, 1990, pages 453 - 459, XP000114397, ISSN: 0925-4005
STARK B H ET AL: "An ultra-thin hermetic package utilizing electroplated gold", TRANSDUCERS '01. EUROSENSORS XV. 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS. DIGEST OF TECHNICAL PAPERS, PROCEEDINGS OF 11TH INTERNATIONAL CONFERENCE ON SOLID STATE SENSORS AND ACTUATORS TRANSDUCERS '01/EUROSENSORS XV, MUNICH,, 2001, Berlin, Germany, Springer-Verlag, Germany, pages 194 - 197 vol.1, XP002252460, ISBN: 3-540-42150-5
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