Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/111986
Kind Code:
A1
Abstract:
Provided is a circuit structure having a novel structure that facilitates more efficient dissipation of the heat from heat-generating components. A circuit structure 10 includes: a main relay 14 constituting a heat-generating component which generates heat through energization; a main relay input-side bus bar 64a and a main relay output-side bus bar 64b which constitute electrically conductive members connected to a first power terminal 50 and a second power terminal 52 which are connection parts of the main relay 14 constituting a heat-generating component; and fastening members 76 fastened to the main relay input-side bus bar 64a and the main relay output-side bus bar 64b, the fastening members 76 having heat dissipation fins 76B.
Inventors:
FUJIMURA YUKI (JP)
TAKEDA HITOSHI (JP)
TAKEDA HITOSHI (JP)
Application Number:
PCT/JP2020/044065
Publication Date:
June 10, 2021
Filing Date:
November 26, 2020
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H02G3/16; H05K7/20
Foreign References:
| JP2017093005A | 2017-05-25 | |||
| US20070041148A1 | 2007-02-22 | |||
| JP2015084609A | 2015-04-30 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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