Title:
CLEANING AGENT, CLEANING METHOD AND SUPPLEMENTARY LIQUID
Document Type and Number:
WIPO Patent Application WO/2023/199589
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a cleaning agent which is capable of removing organic matters and copper oxide adhering to the surface of a copper wiring line, while suppressing etching of copper. The cleaning agent contains a water-soluble carboxylic acid and hydrogen peroxide, and has a concentration of the hydrogen peroxide of less than 0.75% by weight and a pH of less than 2.5. Copper oxide is able to be removed from the surface of a copper wiring line by means of the water-soluble carboxylic acid. Organic matters adhering to the surface of the copper wiring line are able to be removed by means of the hydrogen peroxide. This is considered to be possible since hydrogen peroxide and the water-soluble carboxylic acid react with each other in the cleaning agent, thereby generating a percarboxylic acid. The cleaning agent is also able to suppress etching of the copper wiring line. This is considered to be possible since the water-soluble carboxylic acid adsorbs onto the copper surface. Since the concentration of the hydrogen peroxide is less than 0.75% by weight, etching is able to be further suppressed. Since the pH is less than 2.5, more copper oxide is able to be removed.
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Inventors:
SADANAGA KOSUKE (JP)
HAYASHIZAKI MASAHIRO (JP)
AZUI MOMOKO (JP)
TOJIMA MAMI (JP)
HAYASHIZAKI MASAHIRO (JP)
AZUI MOMOKO (JP)
TOJIMA MAMI (JP)
Application Number:
PCT/JP2023/004943
Publication Date:
October 19, 2023
Filing Date:
February 14, 2023
Export Citation:
Assignee:
MEC CO LTD (JP)
International Classes:
C23G1/10; C11D7/18; C11D7/26
Domestic Patent References:
| WO2007072727A1 | 2007-06-28 |
Foreign References:
| JP2014103349A | 2014-06-05 | |||
| JP2006173180A | 2006-06-29 | |||
| JP2012184329A | 2012-09-27 | |||
| JP2001020087A | 2001-01-23 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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