Title:
COATED CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, ANISOTROPIC CONDUCTIVE ADHESIVE AND ANISOTROPIC CONDUCTIVE JUNCTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2005/004171
Kind Code:
A1
Abstract:
A coated conductive particle is disclosed which is composed of a metal-coated particle and a thermoplastic resin layer strongly bonded to a metal layer of the particle. The thermoplastic resin layer of this coated conductive particle is not dissolved in a solvent, and is not melted when heated. A coated conductive particle (5) comprises a base fine particle (1), a metal coating layer (2) applied onto the base fine particle (1), and a resin layer (3) which is formed on the metal coating layer (2) and composed of a thermoplastic polymer. The thermoplastic polymer is chemically bonded with an organic compound introduced in the metal coating layer (2).
Inventors:
HASEGAWA YASUHIRO (JP)
Application Number:
PCT/JP2004/009755
Publication Date:
January 13, 2005
Filing Date:
July 02, 2004
Export Citation:
Assignee:
NATOCO CO LTD (JP)
HASEGAWA YASUHIRO (JP)
HASEGAWA YASUHIRO (JP)
International Classes:
C09J7/10; C09J9/02; H01B1/22; H01R13/24; H05K3/32; H01R4/04; H01R43/00; (IPC1-7): H01B5/00; H01B1/00; H01B1/22; H01B5/16; C09J9/02; H01R11/01
Domestic Patent References:
| WO2002035555A1 | 2002-05-02 |
Foreign References:
| JP2003157717A | 2003-05-30 |
Attorney, Agent or Firm:
Hosoda, Masutoshi (17-22 Akasaka 2-chom, Minato-ku Tokyo 52, JP)
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