Title:
COMPOSITION COMPRISING HYDROXYLATED EPOXY COMPOUND AND PREPARATION THEREOF
Document Type and Number:
WIPO Patent Application WO/1991/012248
Kind Code:
A1
Abstract:
A composition comprising a compound of general formula (I), which is useful as the raw material of resins used in coating material, adhesive, epoxy resin, etc., and a modifier, wherein x is an integer of 3 to 7, y is an integer of 0 to 50, and Ra and Rb are each hydrogen, methyl or ethyl which may be the same with each other. A process for preparing a composition comprising a compound of formula (I), which comprises either reacting a compound of formula (II) with a lactone at 30 to 20 �C, or epoxidizing a compound of formula (III), wherein x, y, Ra and Rb are each as defined above with a peroxide at 0 to 80 �C.
Inventors:
FUJIWA TAKAAKI (JP)
ISOBE TOMOHISA (JP)
ISOBE TOMOHISA (JP)
Application Number:
PCT/JP1991/000191
Publication Date:
August 22, 1991
Filing Date:
February 15, 1991
Export Citation:
Assignee:
DAICEL CHEM (JP)
International Classes:
B01J23/30; B01J27/08; B01J27/186; B01J31/12; C07B61/00; C07D301/00; C07D301/14; C07D301/16; C07D303/16; C08G63/08; C08G63/664; C08G63/82; C08G63/91; C08G65/22; (IPC1-7): B01J23/30; B01J27/08; B01J27/186; B01J31/12; C07D301/00; C07D301/14; C07D303/16; C08G63/08; C08G63/664
Foreign References:
| DE3528004A1 | 1987-02-05 | |||
| US4680361A | 1987-07-14 | |||
| JPS6178751A | 1986-04-22 |
Other References:
See also references of EP 0466942A4
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