Title:
COMPOSITION FOR FORMING COATING FILM FOR FOREIGN SUBSTANCE REMOVAL, AND SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/117235
Kind Code:
A1
Abstract:
Provided is a composition for forming a coating film for foreign substance removal, the composition containing a polymer and a solvent and being capable of forming a coating film that can be removed by a removal solution, wherein the polymer has the structure represented by formula (1). [In formula (1): R1 represents a hydrogen atom, a protecting group for an imide group that can be deprotected by an alkali, or a protecting group for an imide group that can be deprotected by an acid; and * represents a bond.]
Inventors:
KAMIBAYASHI SATOSHI (JP)
KISHIOKA TAKAHIRO (JP)
KISHIOKA TAKAHIRO (JP)
Application Number:
PCT/JP2023/042991
Publication Date:
June 06, 2024
Filing Date:
November 30, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
H01L21/02; C09D9/00; C09D181/00; C09D183/14
Domestic Patent References:
| WO2022019287A1 | 2022-01-27 | |||
| WO2018159665A1 | 2018-09-07 | |||
| WO2021200789A1 | 2021-10-07 | |||
| WO2021117695A1 | 2021-06-17 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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