Title:
CONDUCTIVE ADHESIVE, METHOD FOR PRODUCING CIRCUIT CONNECTION STRUCTURE, AND CIRCUIT CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/230212
Kind Code:
A1
Abstract:
This conductive adhesive contains an adhesive composition and conductive particles; and the compressive hardness of the conductive particles at 20% compression is 10.0 Gpa or more at 25°C, while being 3.5 Gpa or less at 150°C.
Inventors:
KUDO SUNAO (JP)
ITOH AKIHIRO (JP)
OTO YUMIKO (JP)
SUEYASU YUKA (JP)
ITOH AKIHIRO (JP)
OTO YUMIKO (JP)
SUEYASU YUKA (JP)
Application Number:
PCT/JP2021/017744
Publication Date:
November 18, 2021
Filing Date:
May 10, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J9/02; C09J11/04; C09J201/00; H01B1/22; H01R4/04; H01R11/01; H01R43/00; H05K1/03
Domestic Patent References:
| WO2018230470A1 | 2018-12-20 | |||
| WO2018181694A1 | 2018-10-04 |
Foreign References:
| JP2012064559A | 2012-03-29 | |||
| JP2006196411A | 2006-07-27 | |||
| JP2014207193A | 2014-10-30 | |||
| JP2003323813A | 2003-11-14 | |||
| JP2016001562A | 2016-01-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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