Title:
CONDUCTIVE ADHESIVE, AND UTILIZING THE SAME, CONDUCTIVE SECTION AND ELECTRONIC PART MODULE
Document Type and Number:
WIPO Patent Application WO/2006/064849
Kind Code:
A1
Abstract:
A conductive adhesive that is not only capable of carrying out solder joining for mounting of modularized parts and other electronic parts at low temperature but also simultaneously realizes enhancements of both the conductivity of circuit connection by solder joining and the joint strength by adhesive. There is provided a conductive adhesive comprising an epoxy adhesive having a flux potency and, mixed therewith, SnBi solder powder, wherein the epoxy adhesive having a flux potency is a soldering flux containing at least an epoxy resin, a hardening agent and an organic acid and wherein the SnBi solder powder is a lead-free solder powder of 150 to 170°C melting point. Further, there is provided a conductive adhesive as mentioned above wherein the organic acid is a dibasic acid having an alkyl as a side chain.
More Like This:
Inventors:
OHNO TAKAO (JP)
TAKAHASHI YOSHIYUKI (JP)
ITO SHUJI (JP)
ISOGAI YUKIHIRO (JP)
TAKAHASHI YOSHIYUKI (JP)
ITO SHUJI (JP)
ISOGAI YUKIHIRO (JP)
Application Number:
PCT/JP2005/022964
Publication Date:
June 22, 2006
Filing Date:
December 14, 2005
Export Citation:
Assignee:
TAMURAKAKEN CORP (JP)
OHNO TAKAO (JP)
TAKAHASHI YOSHIYUKI (JP)
ITO SHUJI (JP)
ISOGAI YUKIHIRO (JP)
OHNO TAKAO (JP)
TAKAHASHI YOSHIYUKI (JP)
ITO SHUJI (JP)
ISOGAI YUKIHIRO (JP)
International Classes:
C09J163/00; C09J9/02; H01B1/22; H05K3/34
Foreign References:
| JPH07502369A | 1995-03-09 | |||
| JP2001143529A | 2001-05-25 | |||
| JP2000309773A | 2000-11-07 | |||
| JP2003163139A | 2003-06-06 | |||
| JPH0982577A | 1997-03-28 | |||
| JP2005194306A | 2005-07-21 |
Attorney, Agent or Firm:
Iida, Nobuyuki (5-2 Marunouchi 2-chom, Chiyoda-ku Tokyo, JP)
Download PDF: