CONDUCTIVE ADHESIVE

WIPO Patent Application WO/2005/078034

A1

A conductive adhesive that can be used as a substitute for solder welding to carry out surface mounting of electronic parts for vehicle loading purposes and to provide conductive junction forming means in the manufacturing of electronic parts per se. There is provided a conductive adhesive comprising a conductive medium, such as silver powder, dispersed in a binder resin component of one-pack epoxy thermosetting resin having a composition comprising, as essential components, an epoxy resin component composed mainly of an epoxy compound with polycyclic aromatic ring skeleton, a cyclic acid anhydride as a curing agent component thereof and a coupling agent as an adherence imparting agent.

JP3765731	DIE ATTACHMENT PASTE AND SEMICONDUCTOR DEVICE
JP7005089	Easy to dismantle adhesive materials, hardened bodies, articles and dismantling methods

TERADA NOBUTO (JP)
SHIOI NAOTO (JP)
TOTOKAWA MASASHI (JP)
NINOMIYA YASUNORI (JP)

PCT/JP2005/001941

August 25, 2005

February 09, 2005

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HARIMA CHEMICALS INC (JP)
DENSO CORP (JP)
TERADA NOBUTO (JP)
SHIOI NAOTO (JP)
TOTOKAWA MASASHI (JP)
NINOMIYA YASUNORI (JP)

C09J163/00; C09J9/02; C09J11/04; C09J11/06; H01B1/00; H01B1/22; H05K3/32; C08L63/00; (IPC1-7): C09J163/00; C09J9/02; H01B1/22

JP2003147306A	2003-05-21
JP2003045228A	2003-02-14
JP2000290617A	2000-10-17
JP2000192000A	2000-07-11
JPH0953001A	1997-02-25
JPH1030082A	1998-02-03
JPH11228925A	1999-08-24
JPH09143445A	1997-06-03
JPH05121465A	1993-05-18

Miyazaki, Teruo (16th Kowa Bldg. 9-20, Akasaka 1-chome, Minato-k, Tokyo 52, JP)

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