Title:
CONDUCTIVE FILLER, METHOD FOR MANUFACTURING CONDUCTIVE FILLER, AND CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2015/133474
Kind Code:
A1
Abstract:
Provided is a conductive paste exhibiting exceptional electrical and thermal conductivity. A conductive paste containing a binder resin and a conductive filler that comprises composite particles. Said particles contain a copper powder and a nanosize precipitate that is disposed on the surface of the copper powder, the precipitate comprises at least one transition metal or compound of a transition metal belonging to group 8-10 of the periodic table.
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Inventors:
OHNISHI SHIGEKATSU (JP)
Application Number:
PCT/JP2015/056216
Publication Date:
September 11, 2015
Filing Date:
March 03, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B22F1/052; B22F1/054; B22F1/10; B22F1/102; B22F1/142; B22F1/17; B22F9/08
Domestic Patent References:
| WO2013077666A1 | 2013-05-30 | |||
| WO2013145258A1 | 2013-10-03 |
Foreign References:
| JP2004162164A | 2004-06-10 | |||
| JP2012180564A | 2012-09-20 |
Other References:
See also references of EP 3115130A4
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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