Title:
CONDUCTIVE PASTE, LAMINATED CERAMIC COMPONENT, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/141816
Kind Code:
A1
Abstract:
Provided is a conductive paste having superior adhesion to a substrate, solder heat resistance, and electromigration resistance. The conductive paste contains (A) silver powder, (B) glass frit, (C) an organic binder, and (D) a powder containing the element Cu and at least one metal element selected from the group consisting of V, Cr, Mn, Fe, and Co. The powder (D) preferably contains Cu and Mn. The powder (D) preferably contains Cu and Fe. The powder (D) preferably contains Cu and Co.
Inventors:
YOSHII YOSHIAKI (JP)
Application Number:
PCT/JP2015/058397
Publication Date:
September 24, 2015
Filing Date:
March 20, 2015
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01B1/22; B22F1/10; B22F9/00; H01B1/00; H05K3/12
Domestic Patent References:
| WO2014061765A1 | 2014-04-24 |
Foreign References:
| JPH0514363B2 | 1993-02-24 | |||
| JP2007123301A | 2007-05-17 | |||
| JPH11258793A | 1999-09-24 | |||
| JPS55149356A | 1980-11-20 | |||
| JP2014187255A | 2014-10-02 |
Other References:
See also references of EP 3121819A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
Patent business corporation Tsukuni (JP)
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