Title:
CONDUCTIVE PASTE AND LAMINATED CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2005/055257
Kind Code:
A1
Abstract:
A conductive paste that can be advantageously used in the formation of external electrode (5) composed mainly of copper on an external surface of laminate (4) furnished with internal conductor films (3) composed mainly of nickel, which conductive paste can avoid cracking of the laminate (4) attributed to thickening of the internal conductor films (3) caused by excess diffusion of copper contained in the external electrode (5) into the internal conductor films (3). There is provided a conductive paste comprising copper powder, iron oxide powder, glass powder and an organic vehicle, wherein iron oxide powder is contained in an amount of 3 to 40 vol.% based on the total volume of copper powder and iron oxide powder, and glass powder in an amount of 10 to 25 vol.% based on the total volume of copper powder, iron oxide powder and glass powder.
Inventors:
KOGA SEIJI (JP)
MAEGAWA KIYOTAKA (JP)
HAMADA KUNIHIKO (JP)
MAEGAWA KIYOTAKA (JP)
HAMADA KUNIHIKO (JP)
Application Number:
PCT/JP2004/017060
Publication Date:
June 16, 2005
Filing Date:
November 17, 2004
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KOGA SEIJI (JP)
MAEGAWA KIYOTAKA (JP)
HAMADA KUNIHIKO (JP)
KOGA SEIJI (JP)
MAEGAWA KIYOTAKA (JP)
HAMADA KUNIHIKO (JP)
International Classes:
H01B1/22; H01G4/12; H01G4/232; H01G4/30; (IPC1-7): H01G4/12; H01B1/22
Foreign References:
| JPH05243079A | 1993-09-21 | |||
| JPH06203626A | 1994-07-22 | |||
| JPS63131405A | 1988-06-03 |
Attorney, Agent or Firm:
Koshiba, Masaaki (Nisshin Building 14-22, Shitennoji 1-chome, Tennoji-k, Osaka-shi Osaka 51, JP)
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