Title:
CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2016/104232
Kind Code:
A1
Abstract:
Provided is a conductive paste which is capable of suppressing the occurrence of cracks or surface separation due to thermal expansion difference between a chip electronic component and a substrate, and which is suitable for the formation of an electrode of the chip electronic component. This conductive paste is characterized by containing a conductive filler, a chelating substance, a phenolic resin and a modified epoxy resin.
Inventors:
SHIOI NAOTO (JP)
SAITO HIROSHI (JP)
NAKAISHI MANAMI (JP)
SAITO HIROSHI (JP)
NAKAISHI MANAMI (JP)
Application Number:
PCT/JP2015/085010
Publication Date:
June 30, 2016
Filing Date:
December 15, 2015
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
H01B1/22; H01B1/00; H05K3/32
Foreign References:
| JPH04268381A | 1992-09-24 | |||
| JP2000219811A | 2000-08-08 | |||
| JP2007018932A | 2007-01-25 | |||
| JP2005264095A | 2005-09-29 | |||
| JPH08302312A | 1996-11-19 | |||
| JP2007091899A | 2007-04-12 | |||
| JP2012136697A | 2012-07-19 | |||
| JP2015028869A | 2015-02-12 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
Akio Miyazaki (JP)
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