CONNECTING MATERIAL - SONY CHEMICALS CORP

Title:

CONNECTING MATERIAL

Document Type and Number:

WIPO Patent Application WO/2005/111169

Kind Code:

A1

Abstract:

A liquid or paste-form connecting material capable of realizing connection with high reliability and having, imparted thereto, excellent storability and desirable moisture absorption reflow resistance such that no floating would occur even in a JEDEC level 2A moisture absorption reflow test. There is provided a connecting material comprising a thermosetting component, a nonconductive filler and a silane coupling agent, wherein the silane coupling agent is composed of a first silane coupling agent and a second silane coupling agent. As the first silane coupling agent, use is made of one whose reactivity with the nonconductive filler is higher than the reactivity of the second silane coupling agent with the nonconductive filler. The content of the first silane coupling agent ranges from 0.15 to 1.85 parts by weight per 100 parts by weight of nonconductive filler, while the content of the second silane coupling agent ranges from 0.80 to 12.00 parts by weight per 100 parts by weight of nonconductive filler.

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Inventors:

YAMAMOTO SATOSHI (JP)

Application Number:

PCT/JP2005/000472

Publication Date:

November 24, 2005

Filing Date:

January 17, 2005

Export Citation:

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Assignee:

SONY CHEMICALS CORP (JP)
YAMAMOTO SATOSHI (JP)

International Classes:

C09J9/02; C09J11/00; C09J11/04; C09J11/06; C09J163/00; C09J201/00; H01B1/20; H01B1/22; H01L21/60; H01R11/01; H05K1/03; H05K3/32; (IPC1-7): C09J201/00; C09J9/02; C09J11/06; H01B1/22; H01L21/60; H01R11/01; H05K1/03

Foreign References:

JP2001081439A	2001-03-27
JP2002184793A	2002-06-28
JP2002212525A	2002-07-31
JP2002212536A	2002-07-31
JP2003096426A	2003-04-03

Attorney, Agent or Firm:

TAJIME & TAJIME (New-Well-Ikuta Bldg., 26-28, Mita 1-chome,, Tama-ku, Kawasaki-sh, Kanagawa, JP)

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