Title:
CONNECTING STRUCTURE OF SEMICONDUCTOR ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE USING THE STRUCTURE, AND ELECTRONIC EQUIPMENT USING THE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/1998/010465
Kind Code:
A1
Abstract:
In a semiconductor element connecting structure which connects a semiconductor IC (7) on the surface of a substrate (13), an adhesive layer (31) which is interposed between the substrate (13) and the IC (7) is provided so as to stick the IC (7) to the substrate (13). The adhesive layer (31) has an ACF (32) which works as a bonding agent which bonds the IC (7) to the substrate (13) and a space (33) formed in the ACF (32). Since the thermal deformation and the like of the IC (7) is absorbed by the space (33), the connecting states of bumps (28) and (29) do not become unstable even when the IC (7) is deformed by heat, etc.
Inventors:
UCHIYAMA KENJI (JP)
Application Number:
PCT/JP1997/003115
Publication Date:
March 12, 1998
Filing Date:
September 04, 1997
Export Citation:
Assignee:
SEIKO EPSON CORP (JP)
UCHIYAMA KENJI (JP)
UCHIYAMA KENJI (JP)
International Classes:
G02F1/1343; G02F1/136; H01L21/52; H01L21/56; H01L21/60; G02F1/13; (IPC1-7): H01L21/60
Foreign References:
| JPH06232207A | 1994-08-19 | |||
| JPH03209840A | 1991-09-12 | |||
| JPH02133936A | 1990-05-23 |
Other References:
See also references of EP 0878840A4
Attorney, Agent or Firm:
Suzuki, Kisaburo (4-1 Nishi-Shinjuku 2-chom, Shinjuku-ku Tokyo 163, JP)
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