CONNECTION-STRUCTURE MANUFACTURING METHOD AND CONNECTION-STRUCTURE MANUFACTURING DEVICE

WIPO Patent Application WO/2014/129095

A1

The purpose of the present invention is to provide a connection-structure manufacturing method and manufacturing device whereby a connection structure in which a conductor section is crimped by a closed-barrel crimp section (230), yielding stable conductivity, can be inspected efficiently. The following steps are performed, in this order: a coating stripping step in which an insulating coating (102) is stripped from the tip of a coated wire (100), creating a wire tip section (103); a marking step in which a mark (104) is formed at a prescribed position on the insulating coating (102); a first mark-inspection step in which the stripping state and the mark (104) are inspected; a wire insertion step in which the wire tip section (103) is inserted into a closed-barrel crimp section (230); a crimping step in which the crimp section (230) is crimped so as to crimp-connect the wire tip section (103); and a second mark-inspection step in which the mark (104) is used to inspect the crimping state of the wire tip section (103) in the crimp section (230). The first mark-inspection step and the second mark-inspection step are performed using the same inspection-step unit (14).

KAWAMURA YUKIHIRO (JP)
TAKAMURA SATOSHI (JP)
HYOTANI TAKESHI (JP)
KITAGAWA KOICHI (JP)
ARAMAKI EIJI (JP)
FUKUNAGA KOUKI (JP)

PCT/JP2013/085283

August 28, 2014

December 28, 2013

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FURUKAWA ELECTRIC CO LTD (JP)
FURUKAWA AUTOMOTIVE SYS INC (JP)

H02G1/14; H01B13/00; H01B13/012; H01R43/048; H02G1/12

JP2005327690A	2005-11-24
JP2009272141A	2009-11-19
JPH03245413A	1991-11-01
JPH0888071A	1996-04-02

NAGATA Yoshiaki et al. (JP)
Yoshiaki Nagata (JP)

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