Title:
CONVEX-TYPE ULTRASOUND PROBE
Document Type and Number:
WIPO Patent Application WO/2018/230261
Kind Code:
A1
Abstract:
A backing 20 comprises a lead array 24a which electrically connects vibration elements 12 and a plurality of ICs 32. Bumps 42 provided at the lower end of the leads 24 are connected to a conductor pad on an upper-side surface of a relay substrate 26, and ball-shaped terminals 44 of the ICs 32 are connected to a lower-side surface of the relay substrate 26. The lower end portions of the leads 24 are grouped by means of wiring patterns of the leads into a plurality of dense groups 46 corresponding to the ICs 32 in the longitudinal direction (X-axis direction).
Inventors:
KATSURA HIDETSUGU (JP)
SHIRAISHI TOMOHIRO (JP)
IWASHITA TAKAYUKI (JP)
SHIRAISHI TOMOHIRO (JP)
IWASHITA TAKAYUKI (JP)
Application Number:
PCT/JP2018/019383
Publication Date:
December 20, 2018
Filing Date:
May 18, 2018
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H04R17/00; A61B8/14
Domestic Patent References:
| WO2017006590A1 | 2017-01-12 |
Foreign References:
| JPH0723500A | 1995-01-24 | |||
| JP2017056030A | 2017-03-23 | |||
| JP2015228932A | 2015-12-21 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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