Title:
CONVEYANCE DEVICE AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2013/081013
Kind Code:
A1
Abstract:
This conveyance device, which conveys wafers in a casing (30), is provided with: a primary blowing fan (17) that generates airflow within the casing (30) in a first direction; a discharge opening (26) that is provided to the downstream side of the airflow generated by the primary blowing fan (17), is interconnected with the interior of the casing (30), and discharges gases at the interior of the casing (30) to the outside of the casing (30); a base (18d) that is supported by a gate-shaped conveyance arm (22) disposed within the casing (30) and moves within the casing (30) at the upstream side of the discharge opening (26) and at the downstream side of the primary blowing fan (17); an end effector (21) that is provided to the base (18d) and that carries wafers; and a blowing fan (19) that is provided to the base and that generates airflow in the first direction.
Inventors:
HIROKI TSUTOMU (JP)
SAWADA IKUO (US)
MATSUZAKI KAZUYOSHI (JP)
FUKUHARA YOSHIKI (JP)
SAWADA IKUO (US)
MATSUZAKI KAZUYOSHI (JP)
FUKUHARA YOSHIKI (JP)
Application Number:
PCT/JP2012/080766
Publication Date:
June 06, 2013
Filing Date:
November 28, 2012
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; B25J19/00; B65G49/07; H01L21/205; H01L21/3065
Foreign References:
| JP2009032877A | 2009-02-12 | |||
| JPH0677245U | 1994-10-28 | |||
| JP2011517134A | 2011-05-26 | |||
| JPH1131730A | 1999-02-02 | |||
| JP2009076805A | 2009-04-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
Download PDF:
Claims: