Title:
COOLING DEVICE, ELECTRONIC EQUIPMENT DEVICE, AND METHOD OF MANUFACTURING COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2003/050465
Kind Code:
A1
Abstract:
A small and thin cooling device with high cooling performance, an electronic equipment device, and a method of manufacturing the cooling device, the cooling device (1) comprising rectangular first glass substrate (2) and second glass substrate (3) made of a pair of materials with low thermal diffusivities such as glass bonded to each other through a silicon member (4), wherein grooves (5) and (6) are formed in the bonded surfaces of the substrates (2) and (3) so as to function as a loop−like heat pipe when these grooves (5) and (6) are bonded to each other.
Inventors:
TONOSAKI MINEHIRO (JP)
KATO EISAKU (JP)
SANO NAOKI (JP)
KITAGAWA KOJI (JP)
KATO EISAKU (JP)
SANO NAOKI (JP)
KITAGAWA KOJI (JP)
Application Number:
PCT/JP2002/012334
Publication Date:
June 19, 2003
Filing Date:
November 26, 2002
Export Citation:
Assignee:
SONY CORP (JP)
TONOSAKI MINEHIRO (JP)
KATO EISAKU (JP)
SANO NAOKI (JP)
KITAGAWA KOJI (JP)
TONOSAKI MINEHIRO (JP)
KATO EISAKU (JP)
SANO NAOKI (JP)
KITAGAWA KOJI (JP)
International Classes:
F28D15/02; F25D9/00; H01L23/427; H05K7/20; (IPC1-7): F28D15/02
Foreign References:
| JP2000193385A | 2000-07-14 | |||
| JP2001125151A | 2001-05-11 | |||
| JP2000002493A | 2000-01-07 | |||
| JP2001257297A | 2001-09-21 | |||
| JPS6221591U | 1987-02-09 |
Attorney, Agent or Firm:
Nakamura, Tomoyuki c/o Miyoshi International Patent Office (9th Floor Toranomon Daiichi Building, 2-3,
Toranomon 1-chom, Minato-ku Tokyo, JP)
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