Title:
COOLING DEVICE, COOLING METHOD, AND SEMICONDUCTOR INSPECTION DEVICE, EACH OF WHICH USING THERMOELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2018/096695
Kind Code:
A1
Abstract:
This cooling device is provided with: a heat insulating member that has a heat insulating space therein; a thermoelectric element that is attached to the heat insulating member such that the heat radiation side is arranged in the heat insulating space of the heat insulating member and the heat absorption side is arranged outside the heat insulating member; and one or more cooling elements that are attached to the heat insulating member such that the respective cooling sides are arranged in the heat insulating space of the heat insulating member and the respective heat radiation sides are arranged outside the heat insulating member, wherein the heat absorption surface on the heat absorption side of the thermoelectric element is cooled. The cooling device is preferably provided with: a temperature sensor that measures the temperature of the heat absorption surface; and a control unit that controls the current and/or the voltage of the thermoelectric element and/or the one or more cooling elements so that the temperature of the heat absorption surface becomes the target temperature.
Inventors:
KAMOSHIDA MAKOTO (JP)
YAMAGUCHI SATOSHI (JP)
NAKAMURA MITSUJI (JP)
YAMAGUCHI SATOSHI (JP)
NAKAMURA MITSUJI (JP)
Application Number:
PCT/JP2017/003713
Publication Date:
May 31, 2018
Filing Date:
February 02, 2017
Export Citation:
Assignee:
SHIBASOKU CO LTD (JP)
International Classes:
H01L23/38; F25B21/02; H01L35/30; H05K7/20
Foreign References:
| JP3160814U | 2010-07-08 | |||
| JP2000338603A | 2000-12-08 | |||
| JPH01163425U | 1989-11-14 | |||
| JP2015135932A | 2015-07-27 |
Attorney, Agent or Firm:
ONODERA, Takashi et al. (JP)
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