Title:
COOLING MODULE
Document Type and Number:
WIPO Patent Application WO/2024/095685
Kind Code:
A1
Abstract:
A cooling module according to the present invention includes: a substrate on which a driver for energizing an auxiliary machine installed on a vehicle is mounted; and a module housing for holding the substrate. The module housing has a flow-path housing inside of which is formed a cooling flow path through which a cooling liquid circulates. A heat conducting member is provided spanning the substrate and the cooling flow path.
Inventors:
YAMAMOTO TAKERU (JP)
YAMADA YASUTOSHI (JP)
ISHII MASATO (JP)
YAMAGUCHI TOMOHIRO (JP)
SASAKI SOZABURO (JP)
YAMADA YASUTOSHI (JP)
ISHII MASATO (JP)
YAMAGUCHI TOMOHIRO (JP)
SASAKI SOZABURO (JP)
Application Number:
PCT/JP2023/036322
Publication Date:
May 10, 2024
Filing Date:
October 05, 2023
Export Citation:
Assignee:
AISIN CORP (JP)
International Classes:
H01L23/473; B60R16/02; F28F3/04; H01L25/07; H01L25/18; H05K7/20
Foreign References:
| JPH11163572A | 1999-06-18 | |||
| JP2018182930A | 2018-11-15 | |||
| JP2004247684A | 2004-09-02 |
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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