Title:
COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/185102
Kind Code:
A1
Abstract:
Provided is a copper-fine-particle dispersion liquid with which photosintering can be used to easily form a conductive film having a low electrical resistance. This copper-fine-particle dispersion liquid (1) includes a dispersion medium, and copper fine particles (11) dispersed in the dispersion medium. The copper-fine-particle dispersion liquid (1) includes a sintering promoter. The sintering promoter is a compound which removes copper oxide from copper at a temperature higher than room temperature. Accordingly, during photosintering of the copper fine particles (11), the sintering promoter removes a surface oxide film on the copper fine particles (11).
Inventors:
KAWATO YUICHI (JP)
ARIMURA HIDETOSHI (JP)
KUDO TOMIO (JP)
ARIMURA HIDETOSHI (JP)
KUDO TOMIO (JP)
Application Number:
PCT/JP2014/052222
Publication Date:
November 20, 2014
Filing Date:
January 31, 2014
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; B22F7/04; B22F9/00; C09D5/24; C09D7/12; H01B1/02; H01B5/14; H01B13/00; H05K1/09; H05K3/10
Domestic Patent References:
| WO2013077448A1 | 2013-05-30 |
Foreign References:
| JP2010528428A | 2010-08-19 | |||
| JP5088760B1 | 2012-12-05 | |||
| JP5088761B1 | 2012-12-05 | |||
| JP2011527089A | 2011-10-20 | |||
| JP2010135205A | 2010-06-17 | |||
| JP2010146995A | 2010-07-01 | |||
| JP2010118449A | 2010-05-27 | |||
| JP4978844B2 | 2012-07-18 | |||
| US20080286488A1 | 2008-11-20 |
Attorney, Agent or Firm:
NOGUCHI, YASUHIRO (JP)
Yasuhiro Noguchi (JP)
Yasuhiro Noguchi (JP)
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