Title:
COPPER FOIL AND HIGH-DENSITY MULTI-LAYERED PRINTED CIRCUIT BOARD USING THE COPPER FOIL FOR INNER LAYER CIRCUIT
Document Type and Number:
WIPO Patent Application WO/1996/025838
Kind Code:
A1
Abstract:
A copper foil for an inner layer of a high-density multi-layered printed circuit board wherein bump forming treatment is applied to the luster surface side of an electrolytic copper foil and needle-like or bump-like fine electrodeposition protuberances are formed on the coarse surface side for fine and uniform bump forming, and a high-density multi-layered printed circuit board wherein the circuit board is bonded on the luster surface side of the copper foil to a substrate for an inner layer to form an inner layer circuit.
Inventors:
OHARA MUNEHARU
MITSUHASHI MASAKAZU
SAIDA MUNEO
MITSUHASHI MASAKAZU
SAIDA MUNEO
Application Number:
PCT/JP1996/000331
Publication Date:
August 22, 1996
Filing Date:
February 15, 1996
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H05K1/09; C25D1/04; H05K3/38; H05K3/46; (IPC1-7): H05K3/46; H05K1/09; H05K3/38
Foreign References:
| JPS5438053B1 | 1979-11-19 | |||
| JPH02241087A | 1990-09-25 | |||
| JPH0226097A | 1990-01-29 | |||
| JPS5339327B2 | 1978-10-20 | |||
| JPH02303190A | 1990-12-17 |
Other References:
See also references of EP 0758840A4
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