Title:
COPPER MICROPARTICLE DISPERSION
Document Type and Number:
WIPO Patent Application WO/2023/067740
Kind Code:
A1
Abstract:
The present invention relates to: a copper microparticle dispersion comprising copper nanoparticles A, a carboxylic acid B having 6 to 14 carbon atoms inclusive, a compound C represented by formula (1): RO-(CH2CH2O)n-CH2-COOH (in formula (1), R represents a hydrocarbon group having 6 to 14 carbon atoms inclusive, and n represents an average number of moles of ethyleneoxy groups added and is a numerical value of 0.5 to 20 inclusive) and a dispersion medium D, in which the dispersion medium D comprises at least one component selected from the group consisting of a (poly)alkylene glycol, a (poly)alkylene glycol derivative, terpene alcohol, glycerin and a glycerin derivative, the content of the carboxylic acid B is 0.1% by mass or more, the content of the compound C is 0.05% by mass or more, and the total content of the carboxylic acid B and the compound C is 8% by mass or less; and a method for producing an assembly, comprising a step for heating the copper microparticle dispersion while placing the copper microparticle dispersion between a plurality of metal members.
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Inventors:
EYAMA TAKAAKI (JP)
TAKIGUCHI OSAMU (JP)
YOSHIDA TOMOHIDE (JP)
TAKIGUCHI OSAMU (JP)
YOSHIDA TOMOHIDE (JP)
Application Number:
PCT/JP2021/038814
Publication Date:
April 27, 2023
Filing Date:
October 20, 2021
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
B22F9/00; B22F1/00; H01B1/22
Foreign References:
| JP2014167145A | 2014-09-11 | |||
| JP2011068988A | 2011-04-07 | |||
| JP2012006005A | 2012-01-12 | |||
| JP2020053404A | 2020-04-02 | |||
| JP2017172003A | 2017-09-28 | |||
| JP2008303207A | 2008-12-18 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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