Title:
COPPER POWDER
Document Type and Number:
WIPO Patent Application WO/2015/115139
Kind Code:
A1
Abstract:
Provided is a new copper powder from which a conductive film having a sufficiently reduced thickness can be formed and which, although fine, can ensure conductivity even when used in a small amount.
The copper powder is characterized by having a chlorine concentration of 5-150 wt ppm and a volume-cumulative particle diameter D50 of 0.5-5.0 μm, and having a dendritic shape which comprises one trunk and a plurality of branches obliquely branching off from the trunk and two-dimensionally or three-dimensionally grown. The copper powder is further characterized in that the copper powder particles each having a dendritic shape in which the ratio of the number of branches to the major-axis length L of the trunk (number of branches/trunk major-axis length L (μm)) is 3.0-20.0 account for 80% by number or more of all the copper powder particles.
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Inventors:
MORINAKA HIROYUKI (JP)
OTA KOYU (JP)
OTA KOYU (JP)
Application Number:
PCT/JP2015/050261
Publication Date:
August 06, 2015
Filing Date:
January 07, 2015
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B22F1/06; C22C9/00; B22F1/05; B22F9/24
Domestic Patent References:
| WO2012046666A1 | 2012-04-12 |
Foreign References:
| JP2013019034A | 2013-01-31 | |||
| JP2013100592A | 2013-05-23 | |||
| JPH02122001A | 1990-05-09 |
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
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