Title:
COVER FOR COOLING HEAT GENERATING ELEMENT, HEAT GENERATING ELEMENT MOUNTER AND TEST HEAD
Document Type and Number:
WIPO Patent Application WO/2005/004571
Kind Code:
A1
Abstract:
A cover (5) for cooling a heat generating element capable of touching cooling liquid to an IC device (44) mounted on a substrate (4) by covering the IC device (44) and pass the cooling liquid internally, wherein a groove (bypath) (54) capable of passing air and the cooling liquid is provided from a part in the cover (5) for cooling a heat generating element susceptible to stagnation of air to a position where the cooling liquid flows an the downstream of the stagnating air. Since the stagnating air can pass through the bypath in such a cover (5) for cooling a heat generating element, the stagnating air can be removed effectively while sustaining the degree of freedom in the design of cooling liquid channel.
Inventors:
NISHIURA KOEI (JP)
Application Number:
PCT/JP2003/008299
Publication Date:
January 13, 2005
Filing Date:
June 30, 2003
Export Citation:
Assignee:
ADVANTEST CORP (JP)
NISHIURA KOEI (JP)
NISHIURA KOEI (JP)
International Classes:
B01D19/00; G01N1/00; G12B15/02; H01L23/44; H05K7/20; G01R31/28; H05K; (IPC1-7): H05K7/20; H01L23/44
Foreign References:
| JP2002280507A | 2002-09-27 | |||
| JPH0423458A | 1992-01-27 | |||
| US5270572A | 1993-12-14 | |||
| JPH04243175A | 1992-08-31 | |||
| JPH0534113Y2 | 1993-08-30 |
Attorney, Agent or Firm:
Hayakawa, Yuzi (Suite 501 Hikawa-Annex No.2, 9-5, Akasaka 6-chom, Minato-ku Tokyo, JP)
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