Title:
CRIMPING STRUCTURE FOR METAL MATERIALS, AND BUS BAR USING SAID CRIMPING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/039043
Kind Code:
A1
Abstract:
[Problem] To provide a crimping structure for metal materials, wherein it is possible to stably and tightly join metal materials and to reduce the electrical resistance even when the joined metal materials are formed from different materials. [Solution] A crimping structure for metal materials, the crimping structure being provided with a metal plate (12) on which a hole (14) is formed, and a disk-shaped conductive member (13) which is crimped to the periphery of the hole (14) after being inserted into the hole (14), wherein a groove (17) is disposed on at least one surface in the periphery of the hole (14), and a perpendicular flange (21) protruding from at least one surface is disposed on the outer circumference of the conductive member (13). When the conductive member (13) is inserted into the hole (14) and is crimped to the metal plate (12), the perpendicular flange (21) of the conductive member (13) becomes crushed, and the groove (17) on the metal plate (12) becomes filled with the crushed perpendicular flange (21).
Inventors:
SUZUKI TAKAFUMI (JP)
Application Number:
PCT/JP2012/073112
Publication Date:
March 21, 2013
Filing Date:
September 11, 2012
Export Citation:
Assignee:
SUNCALL CORP (JP)
SUZUKI TAKAFUMI (JP)
SUZUKI TAKAFUMI (JP)
International Classes:
H01M50/503; H01M50/505; H01M50/522; H01R4/06; H01R4/62; H01R11/01; H01R31/08
Domestic Patent References:
| WO2009096013A1 | 2009-08-06 | |||
| WO2012102160A1 | 2012-08-02 |
Foreign References:
| JP2004039256A | 2004-02-05 |
Attorney, Agent or Firm:
ASAKAWA, Tetsu (JP)
Satoshi Asakawa (JP)
Satoshi Asakawa (JP)
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Claims: