Cu BALL - SENJU METAL INDUSTRY CO

Title:

Cu BALL

Document Type and Number:

WIPO Patent Application WO/2014/087514

Kind Code:

A1

Abstract:

Provided is a Cu ball having high sphericity and a low alpha dose despite containing at least given amounts of impurity elements besides Cu. Despite keeping the content of U and T to 5 ppb or less and purity at 99.995% or less in order to minimize soft errors and reduce connection defects, the alpha dose is 0.0200 cph/cm2 or less. Unexpectedly, sphericity of the Cu ball was improved by keeping purity at 99.995% or less.

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Inventors:

KAWASAKI HIROYOSHI (JP)
HATTORI TAKAHIRO (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)

Application Number:

PCT/JP2012/081622

Publication Date:

June 12, 2014

Filing Date:

December 06, 2012

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

B22F1/06; B22F1/065; B22F9/08; B22F9/14; B22F9/30; B23K35/14; C22F1/00; C22F1/02; C22F1/08; H01L21/60

Domestic Patent References:

WO2012120982A1	2012-09-13
WO2011114824A1	2011-09-22
WO1995024113A1	1995-09-08

Foreign References:

JP2005036301A	2005-02-10
JP2005002428A	2005-01-06
JP2011029395A	2011-02-10

Other References: