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Title:
CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/111673
Kind Code:
A1
Abstract:
Disclosed is a curable composition that includes (A) a silane compound copolymer having specific repeating units, (B) a silane coupling agent having a reactive cyclic ether structure, and (C) a curing agent, at a ratio of (A):[(B)+(C)] = 95:5 to 70:30 in terms of the mass ratios of (A) and [(B)+(C)]. Also disclosed are a hardened material formed by hardening the composition and a method for using the aforementioned composition as an adhesive for an optical element fixing material and as a sealing material for an optical element fixing material. With the curable composition, a hardened material can be obtained that does not lose transparency with coloring and has excellent transparency over an extended period of time even when irradiated with high-energy light or when in a high temperature state, and that has high adhesive strength even at high temperatures. The curable composition can be used when forming an optical element fixing material, and in particular can be optimally used as an adhesive for an optical element fixing material and as a sealing material for an optical element fixing material.

Inventors:
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2011/055288
Publication Date:
September 15, 2011
Filing Date:
March 07, 2011
Export Citation:
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Assignee:
LINTEC CORP (JP)
KASHIO MIKIHIRO (JP)
International Classes:
C08L83/04; C08K5/12; C08K5/5435; C09J183/04; H01L21/52; H01L23/29; H01L23/31; H01L33/56; C08G77/04
Domestic Patent References:
WO2009104505A12009-08-27
WO2009101753A12009-08-20
WO2009119634A12009-10-01
WO2008102259A22008-08-28
Foreign References:
JP2009030013A2009-02-12
JP2008116904A2008-05-22
JP2008088415A2008-04-17
JP2008266585A2008-11-06
JP2004359933A2004-12-24
JP2005263869A2005-09-29
JP2006328231A2006-12-07
JPH07309927A1995-11-28
JP2009001752A2009-01-08
Other References:
See also references of EP 2546306A4
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
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Claims:



 
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