CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

Title:

CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/080370

Kind Code:

A1

Abstract:

Provided is a curable resin composition containing an epoxy resin and a curing agent, wherein the curing agent includes a phenol novolak resin containing a structural unit derived from a phenol compound represented by general formula (1). In general formula (1), R1 represents a hydrogen atom or a methyl group, R2 represents a C10-18 aliphatic hydrocarbon group, and n is an integer of 1 or 2.

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Inventors:

NAKAMURA SHINYA (JP)

Application Number:

PCT/JP2019/040522

Publication Date:

April 23, 2020

Filing Date:

October 15, 2019

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

C08G59/62; H01L23/29; H01L23/31

Foreign References:

JP2009132774A	2009-06-18
JP2014201639A	2014-10-27
JP2013082785A	2013-05-09
JP2018024770A	2018-02-15
JP2011246543A	2011-12-08
JP2000063490A	2000-02-29
JP2017501288A	2017-01-12
JP2010535152A	2010-11-18
JP2017110198A	2017-06-22
JP2015089940A	2015-05-11

Attorney, Agent or Firm:

TAIYO, NAKAJIMA & KATO (JP)

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