Title:
CURING AGENT, ADHESIVE COMPOSITION FOR SEMICONDUCTOR COMPRISING SAME, ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR PACKAGE USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/215745
Kind Code:
A1
Abstract:
The present invention relates to a curing agent, an adhesive composition for a semiconductor having excellent adhesion as well as preventing cracks from forming by comprising the curing agent and thus exhibiting excellent durability, an adhesive film for a semiconductor, and a semiconductor package using same.
Inventors:
NAM SEUNG HEE (KR)
LEE KWANG JOO (KR)
KIM JUNG HAK (KR)
CHO EUN BYURL (KR)
KIM YOUNG SAM (KR)
LEE KWANG JOO (KR)
KIM JUNG HAK (KR)
CHO EUN BYURL (KR)
KIM YOUNG SAM (KR)
Application Number:
PCT/KR2021/004779
Publication Date:
October 28, 2021
Filing Date:
April 16, 2021
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C09J201/00; C08K3/013; C08K3/10; C08K5/13; C09J7/00; C09J11/00
Foreign References:
| JP2011137126A | 2011-07-14 | |||
| JP2942291B2 | 1999-08-30 | |||
| JPS62263137A | 1987-11-16 | |||
| KR101472221B1 | 2014-12-11 | |||
| KR20090060804A | 2009-06-15 |
Attorney, Agent or Firm:
PCR INTELLECTUAL PROPERTY LAW FIRM (KR)
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