CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION

Title:

CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2004/074330

Kind Code:

A1

Abstract:

A moisture curing resin having a silyl group at the end is disclosed which exhibits low viscosity when applied and shows excellent adhesion properties when the curing resin itself is used as an adhesive, a sealant or a coating compound. The curing resin has a silicon atom-containing group at the end of the molecule wherein one or more hydrolytic groups such as alkoxy groups, acetoxy groups and oxime groups are directly bound to a silicon atom, while having a thioether group and a hydroxyl group in the molecule. The main chain skeleton of the curing resin is composed of a polyoxyalkylene polymer, a (meth)acrylate polymer or a hydrocarbon polymer.

More Like This:

WO/2004/044037	A SYNTHETIC LATEX COMPOSITION
JP4822644	A method for suppressing an increase in viscosity of a siloxane-modified polymer during aging

Inventors:

SATO SHINICHI (JP)
NOMURA YUKIHIRO (JP)
INUI JUN (JP)

Application Number:

PCT/JP2004/001627

Publication Date:

September 02, 2004

Filing Date:

February 16, 2004

Export Citation:

Click for automatic bibliography generation Help

Assignee:

KONISHI CO LTD (JP)
SATO SHINICHI (JP)
NOMURA YUKIHIRO (JP)
INUI JUN (JP)

International Classes:

C08F8/42; C08G65/336; (IPC1-7): C08F8/42; C08G65/329; C09J171/02; C09J201/10

Foreign References:

JPH02238045A	1990-09-20
JPS6383160A	1988-04-13
JPH06293784A	1994-10-21
JPS6383160A	1988-04-13

Other References: