CUTTING TOOL

WIPO Patent Application WO/2021/140818

A1

A cutting tool including a substrate and a film provided on the substrate, wherein: the film includes a multilayer structural layer that has a first single layer and a second single layer; in the multilayer structural layer, one or more of each of the first single layer and the second single layer are laminated in an alternating manner; the following formula 1 Formula 1: 0.6≤I(200)/[I(200)+I(111)+I220] is satisfied, where I(200), I(111), and I(220) are the X-ray diffraction intensities of a (200) plane, a (111) plane, and a (220) plane in the multilayer structural layer, respectively; the first single layer has an NaCl-type structure in which a c-axis-direction surface interval d1c is greater than an a-axis-direction surface interval d1a; the second single layer has an NaCl-type structure in which the c-axis-direction surface interval d2c is less than the a-axis-direction surface interval d2a; and the following formulas 2, 3, and 4 Formula 2: 1≤d1a/d2a≤1.02 Formula 3: 1.01≤d1c/d2c≤1.05 Formula 4: d1a/d2a